Manufacturing capabilities reference
Reference information from Ampel’s capabilities page ↗, added for project discussion. These are Ampel’s published specifications, not verified Roselle manufacturing commitments. Confirm partner availability, units, and the final fabrication scope in your quote.
| Parameter | Ampel published value |
|---|---|
| Panel size | 18 × 30 |
| Layer count | Up to 14 |
| Circuit width | 0.005 minimum |
| Finished hole | 0.008 minimum |
| Finished copper | Up to 7 oz |
| Plated-hole tolerance | ±0.003 |
| Routed-feature tolerance | ±0.005 |
| Wet-mask allowance | 0.010 per side |
| LPI allowance | 0.0025 per side |
| Annular ring, PTH | Source lists ±0.005 |
| Board thickness | 0.008–0.250 |
Material families: CEM-1/CEM-3, polyimide, cyanate ester, epoxy, PTFE, flex/rigid-flex, high-temperature FR-4, low-Dk/low-Df/high-Tg materials, aluminum-clad and halogen-free constructions; Rogers 3010, 4000, 5880 and 6200 are listed.
Finish options: HASL, lead-free solder, ENIG, hard/selective gold, immersion silver, nickel and tin, OSP; SMOBC is also listed.
Special features: fine-line/SMT and BGA layouts, oversized multilayers, carbon contacts, blind/buried vias, plated slots/edges, epoxy via plugging, controlled impedance and removable masks.
Engineering topics: CAM, photoplotting, panelization and manufacturability review.
Dimensional units and the annular-ring notation are not clarified on the source page. Request confirmation before using these values in a design or order.